PC
Product type: Through holes
Layer: 8L
Thickness:1.2mm
Surface Finish: OSP
Application: PC
Product type：Through holes
Layer: 10L
Thickness:1.2mm
Surface Finish: OSP
Application: PC
Product type：Through holes
Layer: 6L
Thickness:1.2mm
Surface Finish: OSP
Application: PC
Communication
Product type：HDI
Layer：2 stage 10L
Thickness：1.2mm
Surface Finish：G/F +ENIG
Application：communication high-speed high-frequency connector
Product type：Through holes
Layer：6L
Thickness：1.0mm
Surface Finish: OSP
Application：WIFI Module
10 years of dedicating to PCB manufacturing
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