Partner With Innovation Leaders
Leverage our advanced technical capabilities to bring your most demanding PCB projects to life. Contact us today to discuss how we can help you achieve your goals.
Advanced PCB Technical Capabilities
Pioneering innovation in printed circuit board technology with rapid advancements and industry-leading capabilities.
Industry-Leading Technical Expertise
Our continuous investment in research and development has positioned us at the forefront of PCB technology, delivering cutting-edge solutions with rapid advancements year over year.
Advanced Technology
Developing state-of-the-art PCB solutions with industry-leading layer counts, precision drilling, and ultra-fine line widths.
Rapid Innovation
Continuous advancements in technical capabilities with significant improvements in performance metrics year after year.
Precision Engineering
Exceptional precision in manufacturing processes, ensuring tight tolerances and superior quality in every product.
Technical Capabilities
Explore our comprehensive capabilities across different PCB technologies, showcasing our expertise and continuous improvement.
| Project | Technical Capability | 2025 | 2026 | 2027 |
|---|---|---|---|---|
| Normal Capability | Max Number of Layers | 12L | 16L | 20L |
| Finished Board Thickness (Max) | 3.2mm | 3.6mm | 4.0mm | |
| Finished Board Thickness (Thinnest) | 0.5mm | 0.4mm | 0.4mm | |
| Core Board Thickness | 0.05mm | 0.05mm | 0.05mm | |
| Copper Thickness | 1/3oz~6oz | 1/3oz~6oz | 1/3oz~6oz | |
| Max Shipping Size | 500mm×670mm | 480mm×600mm | 600mm×680mm | |
| Min line width / line spacing (mil) | I/L: 2mil/2mil O/L: 2.5mil/3mil |
I/L: 2mil/2mil O/L: 2mil/2mil |
I/L: 2mil/2mil O/L: 2mil/2mil |
|
| Min Drill Bit Size (mil) | 8mil | 6mil | 6mil | |
| Interlayer Alignment (mil) | 3mil | 3mil | 3mil | |
| Warpage | 0.50% | 0.50% | 0.50% | |
| Aspect Ratio | 10:01 | 12:01 | 12:01 | |
| Special Process Capability | N+N Mechanical Blind Holes | / | Yes | Yes |
| Backdrilling Capability (8mil Hole Formation) | / | STUB：2~10mil | STUB：2~10mil | |
| Gold Fingers & Step Gold Fingers | Yes | Yes | Yes | |
| Insertion Loss Test | Yes | Yes | Yes | |
| Step Boards | Yes | Yes | Yes | |
| Impedance Test | ±8% | ±7% | ±5% | |
| Embedded Components | No | No | Yes |
| Project | 2025 | 2026 | 2027 |
|---|---|---|---|
| Max Number of Layers | 8L | 12L | 16L |
| Finished Board Thickness | 0.3-2.4mm | 0.3-2.4mm | 0.3-2.4mm |
| Number of Layers | 1-6 Stage | 1-6 Stage | 1-7 Stage, Any Layer |
| Min Blind Hole Diameter | 3mil, X hole: 2.5mil | 3mil, X hole: 2.5mil | 3mil, X hole: 2.5mil |
| Min Through-Hole Drill Bit Size | 0.15mm | 0.1mm | 0.1mm |
| Min Dielectric Layer Thickness | 0.05mm | 0.04mm | 0.03mm |
| Thinnest Core Board | 0.1mm | 0.01mm | 0.01mm |
| Min Blind Hole Annular Ring | 2.5mil | 2.5mil | 2.5mil |
| Blind Hole Aspect Ratio | 0.8 : 1 | 0.8 : 1 | 0.8 : 1 |
| Through - Hole Aspect Ratio | 10 : 1 | 12 : 1 | 12 : 1 |
| Min line width / line spacing (mil) | I/L: 2mil/2mil O/L: 2.5mil/2mil |
I/L: 1.8mil/1.8mil O/L: 1.8mil/1.8mil |
I/L: 1.7mil/1.7mil O/L: 1.7mil/1.7mil |
| Min BGA pitch(mm) | 0.35mm | 0.325mm | 0.3mm |
| Interlayer Alignment | 3mil | 3mil | 2.5mil |
| Board Thickness Tolerance | ±10% | ±8% | ±8% |
| Impedance Tolerance | ±10% | ±8% | ±8% |
| Blind Hole Dimple | ≤10um | ≤10um | ≤10um |
Our Technical Progress
Witness our rapid advancement across key technical metrics, demonstrating our commitment to innovation and excellence.
Max Number of Layers
Minimum Line Width (mil)
Impedance Tolerance (%)
Minimum Drill Bit Size (mm)
Advanced Materials
We utilize the latest materials to ensure superior performance and reliability in our PCB solutions.
Base Materials
- FR4 Normal Tg
- High C.T.I
- MD Loss (M2)
- Low Loss (M4)
- Very Low Loss (M6)
- Mid Tg
- High Tg
- HF
Surface Finishes
- ENIG (Electroless Nickel Immersion Gold)
- OSP (Organic Solderability Preservative)
- HASL (Hot Air Solder Leveling)
- Immersion Sn
- Immersion Ag
- G/F Plating
- ENIG+OSP
