Smart Office
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Product type：Through holes
Layer：8L
Thickness：1.2 mm
Surface Finish: OSP+G/F
Application：Computer storage memory module
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Product type：Through holes
Layer：6L
Thickness：1.2 mm
Surface Finish：ENIG
Application：Smart office Control
Home Appliance Consumption
Product type：Through-hole
Layer：4 L
Thickness：0.4 mm
Line W/S: 0.1/0.1 mm
Application：Electronic writing board
Product type：Through-hole
Layer：6 L
Thickness：2.4 mm
Heavy：3/3/3/3/3/3
Application：Inverter
Product type：Through-hole
Layer：4 L
Thickness：2.0 mm
Heavy：4/3/3/4
Application：Air conditioning motherboard
10 years of dedicating to PCB manufacturing
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